SCS, an enhanced tin/copper lead free alloy, is highly recommended to directly replace existing SnCu0.7 or SAC solder in different soldering applications [US Patent: 7,472,817; WO 2006/045995 A1; Japanese Patent: 4,048,288]. This alloy not only exhibits the excellent ductility of SnCu0.7 solder, it possesses superior mechanical strength both in ambient and high temperature environments. SCS’s fatigue resistance is now comparable to tin/lead solder and as such, SCS has addressed the fundamental concerns of tin/copper alloys. Its applications cover wave soldering, SMT, HASL, dipping processes, manual/auto soldering and solder joints touch up using solder wires. This cost effective alloy has been designed to meet the most stringent requirements of the electronics industries.

SCS7: Sn/Cu0.7/Si0.02 Melting Temperature = 227 °C
SCSI73: Sn/Cu0.7/Si0.02/In3.0 Melting Temperature = 219-221°C